Lead （Pb）

Lead is a chemical element with symbol Pb (from the Latin plumbum) and atomic number 82. It is a heavy metal that is denser than most common materials. Lead is soft and malleable, and has a relatively low melting point. When freshly cut, lead is bluish-white; it tarnishes to a dull gray color when e

Lead is a chemical element with atomic number 82 and symbol Pb (from the Latin plumbum). It is a heavy metal with a density exceeding that of most common materials; it is soft, malleable, and melts at a relatively low temperature. When freshly cut, it has a bluish-white tint; it tarnishes to a dull

Applications Ferroelectric Gate Dielectric For CMOS Features High purity Custom Sizes Available Manufacturing Process Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate Cleaning and final packaging, Cleaned for use in vacuum, Protection from environmental contaminants Protect

Lead(II) sulfide (also spelled sulphide) is an inorganic compound with the formula PbS. PbS, also known as galena, is the principal ore, and most important compound of lead. It is a semiconducting material with niche uses. Material Notes Lead Sulfide Sputtering Target, Purity is 99.9%;Circular: Diam

Lead telluride is a compound of lead and tellurium (PbTe). It crystallizes in the NaCl crystal structure with Pb atoms occupying the cation and Te forming the anionic lattice. It is a narrow gap semiconductor with a band gap of 0.32 eV. It occurs naturally as the mineral altaite. Material Notes Lead

Applications Ferroelectric Gate Dielectric For CMOS Features High purity Custom Sizes Available Manufacturing Process Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate Cleaning and final packaging, Cleaned for use in vacuum, Protection from environmental contaminants Protect

Applications Ferroelectric Gate Dielectric For CMOS Features High purity Custom Sizes Available Manufacturing Process Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate Cleaning and final packaging, Cleaned for use in vacuum, Protection from environmental contaminants Protect

Applications Ferroelectric Gate Dielectric For CMOS Features High purity Custom Sizes Available Manufacturing Process Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate Cleaning and final packaging, Cleaned for use in vacuum, Protection from environmental contaminants Protect