Tantalum Sputtering Target

Description:

Purity: Ta>99.95%, 99.99%, 99.995%, 99.999%
Standard: ASTM B708-05
Density: >16.1g/cc
AEM can provide tantalum target with uniform, high density microstructure and controlled texture, which promotes uniform sputtering rates and generally superior sputtering behavior.

Chemical Composition:

Typical Purity (ppm)

Impurities	5N Ta	4N5 Ta	4N Ta	3N5 Ta
Fe	<1	<1	<1	<5
Ni	<1	<1	<1	<5
Cr	<1	<1	<1	<5
Cu	<1	<1	<1	<5
Ti	<1	<1	<1	<5
Nb	<10	<50	<100	<500
W	<8	<10	<30	<150
Mo	<5	<10	<10	<30
Na	<0.4	<0.4	<1	<5
Li	<0.1	<0.1	<1	<5
K	<0.4	<0.4	<1	<5
U	<0.001	<0.005	<0.005	<0.005
Th	<0.001	<0.005	<0.005	<0.005
Others	<0.1	<1	<5	<10
C	<10	<10	<20	<30
O	<50	<50	<100	<200
N	<30	<30	<30	<50
H	<5	<5	<10	<10

Specification:

We can supply 8″, 12″ tantalum round shape sputtering target. The largest disc target that we can provide is with 29” diameter. Below are most of the standard sizes for our tantalum rectangle sputtering targets. If you do not see the size that you need, please feel free to contact us.

Thickness	Width	Length	Parallelism	Verticality	Surface finish
8.0~16.0	10~450	10~500	<0.05	<2o	<Ra0.8
3.0~8.0	10~450	10~800	<0.05	<2o	<Ra0.8
1.0~3.0	10~450	10~1200	<0.05	<2o	<Ra0.8

Recrystallization: >95%
Surface Roughness: Ra 0.8-1.6
Flatness: 0.1mm or 0.1%