Copper Silver (Cu/Ag 84:16 wt%) Sputtering Targets
Material Notes
Copper Silver Sputtering Targets, Purity is 99.9%;Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.
Applications
• Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Features
• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade
Manufacturing Process
• Refining
Three-layer electrolytic process
• Melting and casting
Electrical resistance furnace - Semi-continuous casting
• Grain refinement
Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
Protection from environmental contaminants
Protection during shipment
Options
• 99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service