Molybdenum (Mo) Sputtering Targets

InquiryData sheet
Molybdenum is a silvery-grey metal with a Mohs hardness of 5.5. It has a melting point of 2,623 °C (4,753 °F); of the naturally occurring elements, only tantalum, osmium, rhenium, tungsten, and carbon have higher melting points.[6] Weak oxidation of molybdenum starts at 300 °C (572 °F). It has one of the lowest coefficients of thermal expansion among commercially used metals. The tensile strength of molybdenum wires increases about 3 times, from about 10 to 30 GPa, when their diameter decreases from ~50–100 nm to 10 nm.

Material Notes

Molybdenum Sputtering Targets, Purity is 99.95%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Applications
Electronics
• Semiconductor
• Flat panel displays


Features
Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment


Options
99.95% minimum purity
• Semiconductor grade aluminum alloys available
  Al/Si,Al/Cu,Al/Cu/Si
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service

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