Nickel Iron (Ni/Fe) Sputtering Targets

Material Notes

Nickel/Iron Sputtering Targets, Purity is 99.9%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. NOTE: Ferromagnetic materials require additional consideration when selecting configuration/ thickness. High strength magnets or thinner targets may be required. Bonding these materials creates additional concerns due to the increase in distance from the magnets. Contact your magnetron sputter cathode supplier or reference your equipment manual for additional information.

Applications
• Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display

Features
• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade

Manufacturing Process
• Refining
  Three-layer electrolytic process
• Melting and casting
  Electrical resistance furnace - Semi-continuous casting
• Grain refinement
  Thermomechanical treatment
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment

Options
• 99.9% minimum purity
• Planar circular targets up to 18'' (457mm) diameter
• Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service