Silicon Nitride (Si3N4) Sputtering Targets
Silicon nitride is a chemical compound of the elements silicon and nitrogen, with the formula Si3N4. It is a white, high-melting-point solid that is relatively chemically inert, being attacked by dilute HF and hot H2SO4. It is very hard (8.5 on the mohs scale). It is the most thermodynamically stable of the silicon nitrides. Hence, Si3N4 is the most commercially important of the silicon nitrides and is generally understood as what is being referred to where the term "silicon nitride" is used.
Material Notes
Silicon Nitride Sputtering Target, Purity is 99.5%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock