Silicon (Si) Sputtering Targets
Silicon is a solid at room temperature, with a melting point of 1,414 °C (2,577 °F) and a boiling point of 3,265 °C (5,909 °F). Like water, it has a greater density in a liquid state than in a solid state and it expands when it freezes, unlike most other substances. With a relatively high thermal conductivity of 149 W•m-1•K-1, silicon conducts heat well.
Material Notes
Silicon Sputtering Targets, Purity is 99.999%; Circular: Diameter <= 14inch, Thickness >= 1mm; Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm. Bonding is recommended for these materials. Many materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity.This material may require special ramp up and ramp down procedures. This process may not be necessary with other materials. Targets that have a low thermal conductivity are susceptible to thermal shock.
Silicon (Si) (N-type) Sputtering Targets
Silicon (Si)(P-type) Sputtering Targets
Silicon (Si) (undoped) Sputtering Targets